The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Dec. 31, 2015
Applicant:
Htc Corporation, Taoyuan, TW;
Inventors:
Cheng-Han Chung, Taoyuan County, TW;
Chao-Feng Wan, Taoyuan County, TW;
Assignee:
HTC Corporation, Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); C25D 5/02 (2006.01); G06F 1/16 (2006.01); G06F 1/18 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
C25D 5/02 (2013.01); C25D 7/00 (2013.01); G06F 1/1656 (2013.01); G06F 1/18 (2013.01); G06F 1/181 (2013.01); Y10T 29/49155 (2015.01);
Abstract
A manufacturing method of a casing of an electronic device including the following steps is provided. First, a casing body is formed by an injection molding technology, and the casing body includes a button portion. Thereafter, a sensing assembly is electroplated on an inner surface of the casing body. The sensing assembly includes a first conductive line and two first contacts. The first conductive line forms a strain sensing pattern on the button portion, and the two first contacts connect to two ends of the first conductive line, respectively.