The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Oct. 07, 2014
Applicant:
Dic Corporation, Tokyo, JP;
Inventors:
Jian-Jun Yuan, Sakura, JP;
Hiroshi Kinoshita, Sakura, JP;
Assignee:
DIC Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08J 3/00 (2006.01); B22F 1/00 (2006.01); C09K 5/14 (2006.01); C08K 3/22 (2006.01); C08L 101/00 (2006.01); C01F 7/02 (2006.01); C01F 7/44 (2006.01); C09C 1/40 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C01F 7/021 (2013.01); C01F 7/441 (2013.01); C08K 3/22 (2013.01); C08L 101/00 (2013.01); C01P 2002/54 (2013.01); C01P 2004/32 (2013.01); C01P 2004/41 (2013.01); C01P 2004/61 (2013.01); C01P 2006/12 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/005 (2013.01); C09C 1/407 (2013.01);
Abstract
The present invention provides a resin composition including aluminum oxide (A) containing molybdenum having a size on the order of μm or less and a resin (B); and a resin molded body formed by molding the resin composition. Also, the present invention provides a heat-dissipating material containing the resin composition; and a heat-dissipating member containing the resin molded body. The heat-dissipating member of the present invention can be used for electronic parts such as electronic devices, electric devices, OA devices or for LED illumination.