The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
May. 21, 2015
Applicant:
Dongjin Semichem Co., Ltd., Incheon, KR;
Inventors:
Seung Hyuk Lee, Seongnam, KR;
Ju Kyung Han, Seongnam, KR;
Young Mo Kim, Seongnam, KR;
Hyun Seok Yoo, Seongnam, KR;
Kyung Eun Kim, Seongnam, KR;
Assignee:
DONGJIN SEMICHEM CO., LTD., Incheon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); C09D 11/033 (2014.01); H01L 31/0224 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); C09D 11/033 (2013.01); H05K 1/02 (2013.01); H01L 31/022425 (2013.01);
Abstract
The present invention relates to a conductive composition, and more particularly, to a conductive copper ink or paste composition for forming fine pattern which comprises a metal precursor and copper powder to increase the density of metal pattern formed during sintering and improve surface roughness, thereby being capable of achieving excellent electrical conductivity, adhesion strength to a substrate, and printability.