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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10113066 B1

PDFFull Text
Date of Patent:
Oct. 30, 2018

Filed:

Nov. 04, 2014

Curable composition, cured coating film using same, and printed wiring board

Applicant:

Taiyo Ink Mfg. Co., Ltd., Hiki-gun, JP;

Inventors:

Masayuki Shimura, Hiki-gun, JP;

Yoshiyuki Furuta, Hiki-gun, JP;

Masao Yumoto, Hiki-gun, JP;

Assignee:

TAIYO INK MFG. CO., LTD., Hiki-gun, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Betelhem Shewareged

Int. Cl.
CPC ...
C09D 4/00 (2006.01); C09D 201/08 (2006.01); G03F 7/004 (2006.01); G03F 7/00 (2006.01); C08F 8/14 (2006.01); H05K 3/06 (2006.01); H05K 3/28 (2006.01); C09D 11/101 (2014.01); C09D 11/30 (2014.01); C09D 133/14 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); C08F 220/06 (2006.01); C08F 220/32 (2006.01);
U.S. Cl.
CPC ...
C09D 4/00 (2013.01); C08F 8/14 (2013.01); C09D 11/101 (2013.01); C09D 11/30 (2013.01); C09D 133/14 (2013.01); C09D 201/08 (2013.01); G03F 7/00 (2013.01); G03F 7/004 (2013.01); H05K 1/0313 (2013.01); H05K 3/0023 (2013.01); H05K 3/064 (2013.01); H05K 3/287 (2013.01); C08F 220/06 (2013.01); C08F 220/32 (2013.01); H05K 2203/0759 (2013.01);
Abstract

Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).

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