The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Jan. 27, 2015
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Yousuke Hirota, Chiba, JP;

Takamitsu Nakamura, Chiba, JP;

Yutaka Satou, Chiba, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/08 (2006.01); C08J 5/24 (2006.01); C08K 5/1545 (2006.01); C08L 63/00 (2006.01); C08J 5/10 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01); H05K 3/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
C08G 59/08 (2013.01); C08J 5/10 (2013.01); C08J 5/24 (2013.01); C08K 5/1545 (2013.01); C08L 63/00 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01); H05K 1/0326 (2013.01); H05K 1/0366 (2013.01); H05K 3/022 (2013.01); H05K 3/18 (2013.01); H05K 3/4676 (2013.01); C08J 2363/04 (2013.01); H05K 2201/0959 (2013.01);
Abstract

An epoxy resin exhibits a small change in volume after thermal history, is excellent in low thermal expansion and low moisture absorption, and has high heat resistance, in terms of a cured product obtained therefrom; a curable resin composition; a cured product which has all the above properties; a semiconductor encapsulating material; a semiconductor device; a prepreg; a circuit board; a buildup film; a buildup substrate; a fiber-reinforced composite material; and a molded article. The present invention is characterized by an epoxy resin, characterized by including as essential components, a cresol-naphthol co-condensed novolac type epoxy resin (A), a naphthol glycidyl ether compound (B), and one or more xanthene compounds (C) selected from the group of compounds represented by the following structural formulae (1) to (3), wherein the content of the xanthene compound(s) (C) is from 0.1% to 5.5% in terms of area ratio in a GPC measurement.


Find Patent Forward Citations

Loading…