The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Oct. 18, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Rene Valenzuela, San Diego, CA (US);

Ryan M. Smith, San Diego, CA (US);

Ken Hung, Taoyuan, TW;

Jeff Lin, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65H 1/12 (2006.01); B65H 1/14 (2006.01);
U.S. Cl.
CPC ...
B65H 1/12 (2013.01); B65H 1/14 (2013.01); B65H 2401/10 (2013.01); B65H 2403/60 (2013.01); B65H 2404/5322 (2013.01); B65H 2601/521 (2013.01); B65H 2801/06 (2013.01);
Abstract

A contact interface includes a first contact member including a first contact surface with a first material subsurface and a second material subsurface. The second material subsurface protrudes transversely above the first material subsurface. A second contact member includes a second contact surface to slide in contact with the first contact surface. The first material subsurface comprises a first material. The second material subsurface comprises a second material. The second material has a lower hardness than the first material.


Find Patent Forward Citations

Loading…