The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Feb. 27, 2015
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Chien Hua Chen, Corvallis, OR (US);
Michael W Cumbie, Corvallis, OR (US);
Erik D Torniainen, Albany, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/19 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/19 (2013.01); B41J 2/1404 (2013.01); B41J 2/14201 (2013.01); B41J 2/1601 (2013.01); B41J 2/1607 (2013.01); B41J 2/1637 (2013.01); B41J 2002/14419 (2013.01);
Abstract
A fluid ejection die has a substrate through which an array of fluid feed holes is formed. The fluid feed holes are separated by ribs. Each fluid feed hole is to guide fluid to an array of drop generators.