The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Dec. 28, 2017
Applicant:

Lenovo Enterprise Solutions (Singapore) Pte. Ltd., New Tech Park, SG;

Inventors:

Andrew Thomas Junkins, Morrisville, NC (US);

Vinod Kamath, Morrisville, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/18 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20772 (2013.01); G06F 1/20 (2013.01); G06F 1/203 (2013.01); H05K 7/20254 (2013.01); H05K 7/20272 (2013.01);
Abstract

A liquid-cooling mechanism, or sub-system, has a thermally conductive plate in which a cooling liquid channel is disposed, and a thermally conductive pad disposed on the thermally conductive plate. An electronic device is mounted to the thermally conductive pad, such as via a mounting component, in a manner that decreases translational movement of a contact surface of the electronic device against a contact surface of the thermally conductive pad. When mounted to the thermally conductive pad, the electronic device compresses the thermally conductive pad.


Find Patent Forward Citations

Loading…