The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Oct. 17, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Yasuhiro Shimizu, Nagaokakyo, JP;

Kiyoyuki Nakagawa, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 5/02 (2006.01); H05K 13/00 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0217 (2013.01); H05K 13/0084 (2013.01);
Abstract

An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material, and a cover tape affixed to the one surface of the carrier tape so as to cover the openings in the respective electronic component holding portions. A thickness dimension of a base portion of the electronic component holding portion is smaller than a thickness dimension of the base material.


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