The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Mar. 07, 2011
Applicants:

Jian Yin, San Jose, CA (US);

Matthew Harris, Raleigh, NC (US);

Inventors:

Jian Yin, San Jose, CA (US);

Matthew Harris, Raleigh, NC (US);

Assignee:

INTERSIL AMERICAS INC., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 1/18 (2006.01); H01L 23/495 (2006.01); H01L 23/64 (2006.01); H01L 25/16 (2006.01); H01F 27/06 (2006.01); H05K 3/20 (2006.01); H05K 3/28 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H01L 23/495 (2013.01); H01L 23/49531 (2013.01); H01L 23/49575 (2013.01); H01L 23/645 (2013.01); H01L 25/16 (2013.01); H01F 2027/065 (2013.01); H01L 24/48 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H05K 3/202 (2013.01); H05K 3/284 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10515 (2013.01); H05K 2203/1327 (2013.01);
Abstract

An embodiment of a power-supply module includes a molded package, power-supply components disposed within the package, and an inductor disposed within the package and over the power-supply components. For example, for a given output-power rating, such a power-supply module may be smaller, more efficient, and more reliable than, and may run cooler than, a power-supply module having the inductor mounted outside of the package or side-by-side with other components. And for a given size, such a module may have a higher output-power rating than a module having the inductor mounted outside of the package or side-by-side with other components.


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