The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Apr. 13, 2017
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01R 4/02 (2006.01); H01R 12/53 (2011.01); H01R 43/02 (2006.01); H01R 12/50 (2011.01); H01R 13/6595 (2011.01); H01R 13/6581 (2011.01); H01R 12/70 (2011.01); H01R 24/50 (2011.01);
U.S. Cl.
CPC ...
H05K 1/025 (2013.01); H01R 4/02 (2013.01); H01R 12/53 (2013.01); H05K 1/184 (2013.01); H01R 12/707 (2013.01); H01R 13/6581 (2013.01); H01R 13/6595 (2013.01); H01R 23/6893 (2013.01); H01R 24/50 (2013.01); H01R 43/0256 (2013.01);
Abstract
A cable connection board includes a signal layer disposed inside a board, a first layer and a second layer disposed inside the board with the signal layer being interposed therebetween, a cable coupled to the board so as to extend to a first surface of the board, a first solder joint portion that joins an outer conductor included in the cable and the first layer to each other, and a second solder joint portion that joins a front end of an inner conductor included in the cable and the signal layer to each other in the board.