The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Jul. 10, 2017
Applicant:

Flir Systems, Inc., Wilsonville, OR (US);

Inventors:

Andrew C. Teich, West Linn, OR (US);

William A. Terre, Santa Barbara, CA (US);

Pierre Boulanger, Goleta, CA (US);

Jeffrey D. Frank, Santa Barbara, CA (US);

John H. Distelzweig, Santa Barbara, CA (US);

Assignee:

FLIR Systems, Inc., Wilsonville, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/33 (2006.01); H04N 5/369 (2011.01); G01J 5/02 (2006.01); G01J 5/04 (2006.01); G01J 5/12 (2006.01); G01J 5/20 (2006.01); G01J 5/08 (2006.01); G01J 5/00 (2006.01);
U.S. Cl.
CPC ...
H04N 5/33 (2013.01); G01J 5/025 (2013.01); G01J 5/026 (2013.01); G01J 5/04 (2013.01); G01J 5/0846 (2013.01); G01J 5/12 (2013.01); G01J 5/20 (2013.01); H04N 5/3696 (2013.01); G01J 2005/0048 (2013.01); G01J 2005/0077 (2013.01); Y10T 29/49117 (2015.01);
Abstract

Various techniques are provided for an infrared sensor assembly having a hybrid infrared sensor array. In one example, such a hybrid infrared sensor array may include a plurality of microbolometers and a non-bolometric infrared sensor. The non-bolometric infrared sensor may be a thermopile or other type of infrared sensor different from a bolometer-based sensor. The non-bolometric infrared sensor may be utilized to provide a more accurate and stable temperature reading of an object or area of a scene captured by the array. In some embodiments, the non-bolometric infrared sensor may also be utilized to perform a shutter-less radiometric calibration of the microbolometers of the array. An infrared sensor assembly may include, for example, the hybrid infrared sensor array, as well as a substrate including bond pads and/or appropriate circuits to obtain and/or transmit output signals from the non-bolometric infrared sensor.


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