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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10110312 B1

PDFFull Text
Date of Patent:
Oct. 23, 2018

Filed:

Apr. 18, 2017

Visible light communication emission device with improved response frequency

Applicant:

South China Normal University, Guangzhou, Guangdong, CN;

Inventors:

Zhiyou Guo, Guangdong, CN;

Jie Sun, Guangdong, CN;

Jing Huang, Guangdong, CN;

Huiqing Shun, Guangdong, CN;

Hongyong Huang, Guangdong, CN;

Yong Huang, Guangdong, CN;

Xian Yang, Guangdong, CN;

Zhuding Zhang, Guangdong, CN;

Yang Liu, Guangdong, CN;

Min Guo, Guangdong, CN;

Shunyu Yao, Guangdong, CN;

Xinyan Yi, Guangdong, CN;

Xuancong Fang, Guangdong, CN;

Assignee:

SOUTH CHINA NORMAL UNIVERSITY, Guangzhou, Guangdong, CN;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Telly Green

Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 33/00 (2010.01); H04B 10/50 (2013.01); H04B 10/116 (2013.01); H05B 33/08 (2006.01); H01L 27/15 (2006.01); H01L 49/02 (2006.01); H01L 33/12 (2010.01); H01L 33/06 (2010.01); H01L 33/14 (2010.01); H01L 33/42 (2010.01);
U.S. Cl.
CPC ...
H04B 10/502 (2013.01); H01L 27/15 (2013.01); H01L 28/10 (2013.01); H01L 33/06 (2013.01); H01L 33/12 (2013.01); H01L 33/145 (2013.01); H01L 33/42 (2013.01); H04B 10/116 (2013.01); H05B 33/0821 (2013.01);
Abstract

A visible light communication emission device with improved response frequency is provided, comprising a substrate, wherein an inductance coil module is provided on the substrate, a LED chip matrix formed by series connection of a plurality of LED chips is provided on the inductance coil module, and the inductance coil module and the LED chip matrix are connected in series, wherein inductance value L of the inductance coil module is configured to be: L=1/(ωC), with C representing capacity in the device provided by LED chips and ω representing frequency, wherein the inductance coil module comprises more than one inductance coil whose composition materials from inside to outside are successively Cr, Al, Cr, Ti, and Ag.

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