The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Apr. 08, 2015
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventor:
Yohei Shimizu, Tokyo, JP;
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/338 (2013.01); H01L 41/047 (2006.01); H03H 3/08 (2006.01); H03H 9/10 (2006.01); H03H 9/72 (2006.01);
U.S. Cl.
CPC ...
H01L 41/338 (2013.01); H01L 41/0471 (2013.01); H03H 3/08 (2013.01); H03H 9/1064 (2013.01); H03H 9/1092 (2013.01); H03H 9/72 (2013.01); Y10T 29/42 (2015.01); Y10T 29/43 (2015.01); Y10T 29/49005 (2015.01);
Abstract
A method for manufacturing an acoustic wave device includes: forming reforming regions in a substrate along a first direction and a second direction intersecting the first direction by irradiating the substrate with a laser beam under different conditions in the first direction and the second direction, the substrate including a piezoelectric substrate on which an IDT (InterDigital Transducer) is formed, and linear expansion coefficients of the piezoelectric substrate being different in the first direction and the second direction; and cutting the substrate in the first direction and the second direction at the reforming regions.