The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Sep. 12, 2016
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Donald William Kidwell, Jr., Los Gatos, CA (US);

Ravindra Shenoy, Dublin, CA (US);

Jon Lasiter, Stockton, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/04 (2006.01); B06B 1/06 (2006.01); H01L 41/113 (2006.01); H01L 41/083 (2006.01); H01L 41/187 (2006.01); H01L 41/047 (2006.01); H01L 41/277 (2013.01); H01L 41/23 (2013.01);
U.S. Cl.
CPC ...
H01L 41/1132 (2013.01); B06B 1/0622 (2013.01); H01L 41/042 (2013.01); H01L 41/0472 (2013.01); H01L 41/083 (2013.01); H01L 41/187 (2013.01); H01L 41/23 (2013.01); H01L 41/277 (2013.01);
Abstract

Embodiments of a sensor device and methods for manufacturing the same are disclosed. In one embodiment, a sensor device comprises a piezoelectric micromechanical ultrasonic transducer (PMUT) array configured to transmit and receive ultrasonic signals, where the PMUT array comprises a plurality of PMUTs and the PMUT array is flexible, one or more integrated circuits configured to process the ultrasonic signals, a battery configured to provide power to the PMUT array and the one or more integrated circuits, a coupling material configured to hold the PMUT array, the one or more integrated circuits, and the battery, and a capsule configured to seal the PMUT array, the one or more integrated circuits, the battery and the coupling material within the capsule.


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