The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

May. 15, 2017
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventor:

Kazuhiro Kamada, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); F21K 9/60 (2016.01); H01L 33/44 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); F21K 9/60 (2016.08); H01L 33/44 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01);
Abstract

A light emitting device includes a substrate, a light emitting element, a first resin member, and a second resin member. The substrate includes a base member, a plurality of wiring portions disposed on a first surface and a second surface of the base member, and a covering layer that covers the wiring portions disposed on the first surface and has an opening formed in a part of the covering layer. The light emitting element is arranged on the wiring portions disposed on the first surface in the opening of the covering layer and having an upper surface at a position higher than the covering layer. The first resin member is arranged at least in the opening of the covering layer and at periphery of the light emitting element. The second resin member seals the substrate and the light emitting element and has an outer border that is arranged above the covering layer. The covering layer is exposed at an outer side of the second resin member. The wiring portions disposed on the second surface are not directly or indirectly electrically connected to the light emitting element.


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