The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Dec. 11, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Toshiya Tadakuma, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/167 (2006.01); H01L 31/0203 (2014.01); H01L 31/02 (2006.01); H01L 23/00 (2006.01); H03K 17/795 (2006.01); H02M 7/537 (2006.01); H02P 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 31/167 (2013.01); H01L 24/48 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/02019 (2013.01); H02M 7/537 (2013.01); H03K 17/795 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48245 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14252 (2013.01); H02P 27/06 (2013.01);
Abstract

A semiconductor module includes a photocoupler, a gate driving IC, and a switching element, and at least one of a first structure and a second structure, wherein the first structure is a structure where in a part of a surface of a first lead frame joined to a bottom surface electrode of a light-emitting element, a first conductive layer is disposed with an insulating layer interposed, and a top surface electrode of the light-emitting element, and the first conductive layer are electrically connected by a wire, and the second structure is a structure where in a part of a surface of a second lead frame joined to a bottom surface electrode of a light-receiving element, a second conductive layer is disposed with an insulating layer interposed, and a top surface electrode of the light-receiving element, and the second conductive layer are electrically connected by a wire.


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