The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Jul. 23, 2015
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Shigefumi Dohi, Kanagawa, JP;

Toshitaka Akahoshi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 27/144 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/146 (2013.01); H01L 24/19 (2013.01); H01L 27/1443 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/351 (2013.01);
Abstract

A laminated semiconductor device includes: a first semiconductor element provided with a photoelectric conversion region on its main surface; an extended portion extended outwardly from a side end surface of the first semiconductor element; a redistribution layer formed on a first surface of the extended portion; a second semiconductor element provided on the main surface of the first semiconductor element so as to extend to the extended portion from an outside of the photoelectric conversion region, the second semiconductor element being electrically connected to the first semiconductor element and the redistribution layer; and a first electrode pad formed on the redistribution layer and electrically connected to the second semiconductor element via the redistribution layer.


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