The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Jul. 18, 2017
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kwang-Ryul Lee, Asan-si, KR;
Boseong Kim, Songnam-si, KR;
Taeduk Nam, Seoul, KR;
Wangju Lee, Cheonan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A solid state drive package is provided. The solid state drive package may include an integrated circuit substrate including: a lower redistribution layer; a first chip and a second chip provided on the lower redistribution layer; and a connection substrate provided on the lower redistribution layer, the connection substrate provided on an outer periphery of the first chip and the second chip; and a plurality of third chips provided on the integrated circuit substrate. The plurality of third chips are electrically connected to the first chip and the second chip via the connection substrate and the lower redistribution layer.