The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Oct. 24, 2017
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Mamoru Yamagami, Kyoto, JP;
Kenji Fujii, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 23/525 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 23/49524 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 24/73 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 23/525 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/03914 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04034 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05583 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/08245 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13076 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13664 (2013.01); H01L 2224/1411 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/40247 (2013.01); H01L 2224/40479 (2013.01); H01L 2224/40491 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/40993 (2013.01); H01L 2224/4112 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/4912 (2013.01); H01L 2224/49177 (2013.01); H01L 2224/73221 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/181 (2013.01); H01L 2924/20754 (2013.01); H01L 2924/351 (2013.01);
Abstract
An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.