The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Mar. 23, 2016
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Ali Eray Topak, Stuttgart, DE;
Marcel Daniel Blech, The Hague, NL;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/538 (2006.01); H01Q 13/18 (2006.01); H01Q 21/28 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2006.01); H01P 3/12 (2006.01); H01P 3/14 (2006.01); H01P 5/107 (2006.01); H01L 23/31 (2006.01); H01Q 21/06 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 23/645 (2013.01); H01L 25/0655 (2013.01); H01P 3/121 (2013.01); H01P 3/14 (2013.01); H01P 5/107 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/5385 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16153 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/3025 (2013.01); H01Q 13/18 (2013.01); H01Q 21/064 (2013.01); H01Q 21/28 (2013.01);
Abstract
A package for embedding one or more electronic components comprises a carrier structure a silicon-based carrier layer, one or more electronic components embedded in one or more cavities formed in the carrier layer, and a cover structure arranged on top of the carrier structure. The cover structure comprises a cover layer and one or more cavities formed in the cover layer. An antenna element and/or a waveguide for connection to an antenna element is formed in and/or on top of the cover layer and coupled to the one or more cavities.