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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10109595 B1

PDFFull Text
Date of Patent:
Oct. 23, 2018

Filed:

Sep. 16, 2016

Double-sided package module and substrate strip

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Do Jae Yoo, Suwon-si, KR;

Hee Jung Jung, Suwon-si, KR;

Jong In Ryu, Suwon-si, KR;

Ki Joo Sim, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Fazli Erdem

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/486 (2013.01); H01L 21/4817 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/49805 (2013.01); H01L 23/49827 (2013.01); H01L 25/0652 (2013.01); H01L 25/18 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01);
Abstract

A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.

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Quick Actions:

Yoo, Do. (2018). Double-sided package module and substrate strip (U.S. Patent No. 10109595). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10109595

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