The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Nov. 29, 2017
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Daisuke Tanaka, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 23/50 (2013.01); H01L 2924/141 (2013.01); H01L 2924/30105 (2013.01);
Abstract

A mounting structure includes a silicon die, an interposer, a substrate, and a capacitor. The capacitor includes a multilayer body, a first outer electrode provided on one end surface of the multilayer body, a second outer electrode provided on another end surface of the multilayer body, and a third outer electrode provided on side surfaces of the multilayer body, and a portion of the capacitor at the first outer electrode side is embedded within the interposer. The first outer electrode is connected to a power supply terminal of the silicon die through a via of the interposer. The second outer electrode is connected to a power supply pattern on the substrate. The third outer electrode is connected to a ground pattern within the interposer.


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