The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Dec. 11, 2015
Denso Corporation, Kariya, Aichi-pref., JP;
Tetsuto Yamagishi, Kariya, JP;
Toshihiro Nagaya, Kariya, JP;
Masayuki Takenaka, Kariya, JP;
Shinji Hiramitsu, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.