The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Jun. 22, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Fabio Brucchi, Villach, AT;
Davide Chiola, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/043 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01); H01L 21/48 (2006.01); H01L 23/492 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 21/4878 (2013.01); H01L 23/3121 (2013.01); H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/4924 (2013.01); H01L 24/32 (2013.01); H01L 25/072 (2013.01); H01L 25/112 (2013.01); H01L 21/565 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15153 (2013.01);
Abstract
Various embodiments provide an electronic module comprising a baseplate. A recess is formed in one main surface of the baseplate, wherein the recess is adapted to accommodate an electronic chip. The electronic chip is attached to a substrate or carrier and is placed in the recess.