The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Jan. 24, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventor:

Christian A. Witt, Woodbridge, CT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/3213 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76892 (2013.01); H01L 21/32134 (2013.01); H01L 21/76843 (2013.01); H01L 21/76865 (2013.01); H01L 21/76877 (2013.01); H01L 21/76883 (2013.01); H01L 21/76889 (2013.01); H01L 23/53266 (2013.01);
Abstract

The disclosure relates to integrated circuit (IC) fabrication techniques. Methods according to the disclosure can include: forming a reaction layer on the upper surface of a conductor, the upper surface of a refractory metal liner, and the upper surface of an insulator layer; annealing the reaction layer such that a portion of the reaction layer reacts with the conductor to form a semiconductor-metal alloy region; removing a portion of the reaction layer to expose the refractory metal liner; removing a portion of the refractory metal liner to approximately a depth of the semiconductor-metal alloy region; and removing the semiconductor-metal alloy region to expose a portion of the conductor such that a remainder of the conductor and a remainder of the refractory metal liner are recessed relative to an upper surface of the insulator layer.


Find Patent Forward Citations

Witt, Christian. (2018). Recessing of liner and conductor for via formation (U.S. Patent No. 10109524). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10109524

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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