The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Aug. 25, 2016
Applicants:

Furukawa Electric Co., Ltd., Tokyo, JP;

Furukawa Magnet Wire Co., Ltd., Tokyo, JP;

Inventors:

Hideo Fukuda, Tokyo, JP;

Tsuneo Aoi, Tokyo, JP;

Dai Fujiwara, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01B 3/30 (2006.01); H01F 5/06 (2006.01); H01B 3/42 (2006.01); H02K 3/30 (2006.01); H02K 3/32 (2006.01); H02K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01B 3/308 (2013.01); H01B 3/305 (2013.01); H01B 3/306 (2013.01); H01B 3/42 (2013.01); H01F 5/06 (2013.01); H02K 3/30 (2013.01); H02K 3/32 (2013.01); H02K 3/34 (2013.01);
Abstract

A rectangular insulated wire includes a rectangular conductor having a generally rectangular cross section and a plurality of baked-coating resin layers disposed to cover the rectangular conductor. Each of the plurality of baked-coating resin layers is formed of at least one resin selected from a group comprising a polyester-based resin including a trihydric or tetrahydric alcohol constituent, a polyester imide resin, a polyamide-imide resin and a polyimide resin. An adhesion strength between the plurality of baked-coating resin layers is greater than or equal to 5 g/mm and less than or equal to 10 g/mm.


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