The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Sep. 01, 2017
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Pierre-Olivier Jubert, San Jose, CA (US);

Kumar Srinivasan, Redwood City, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/73 (2006.01); G11B 5/708 (2006.01); G11B 5/706 (2006.01); G11B 13/08 (2006.01); G11B 5/49 (2006.01); G11B 5/738 (2006.01); H01F 10/10 (2006.01); H01F 10/12 (2006.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
G11B 5/708 (2013.01); G11B 5/49 (2013.01); G11B 5/70621 (2013.01); G11B 5/732 (2013.01); G11B 5/738 (2013.01); G11B 5/7325 (2013.01); G11B 13/08 (2013.01); H01F 10/10 (2013.01); H01F 10/12 (2013.01); G11B 2005/0021 (2013.01);
Abstract

A heat-assisted magnetic recording (HAMR) medium includes a perpendicular magnetic recording layer (typically a chemically-ordered FePt alloy), a seed/thermal barrier layer (typically MgO) below the recording layer, and a heat-sink layer with anisotropic thermal conductivity below the seed/thermal barrier layer. The in-plane thermal conductivity of the heat-sink layer is greater than its out-of-plane thermal conductivity. The heat-sink layer may be selected from hexagonal boron nitride (h-BN), hexagonal graphite, and the 6H polytype of hexagonal silicon carbide (6H-SiC). If the heat-sink layer is h-BN, the h-BN layer is formed on a seed layer and has its c-axis oriented out-of-plane (substantially orthogonal to the surface of the medium substrate).


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