The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Aug. 11, 2016
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventor:

Tasuku Satou, Ashigarakami-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); H05K 3/12 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/04 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); H05K 1/092 (2013.01); H05K 3/0058 (2013.01); H05K 3/04 (2013.01); H05K 3/1258 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H05K 2201/0769 (2013.01); H05K 2201/09045 (2013.01); H05K 2203/0139 (2013.01); H05K 2203/124 (2013.01);
Abstract

An object of the invention is to provide a conductive film that can prevent an operation error caused by ion migration and is suitable for, for example, a projected capacitive touch panel, a method for manufacturing the conductive film, and a touch panel using the conductive film. In the conductive film, a resin layer is laminated on a surface of a substrate. A mesh-shaped groove portion is formed in a surface of the resin layer. A thin metal wire is provided in the groove portion to form an electrode pattern. When a value indicating ion migration characteristics of the electrode pattern in a longitudinal direction is ML and a value indicating ion migration characteristics of the electrode pattern in a lateral direction is MS, a migration ratio obtained by dividing the larger of the two values ML and MS by the smaller value is in the range of 1.0 to 1.4.


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