The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

May. 15, 2017
Applicant:

Champ Tech Optical (Foshan) Corporation, Foshan, CN;

Inventors:

Meng Fu, Foshan, CN;

Qiao-Long Chen, Foshan, CN;

Wu-Fei Xu, Foshan, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); G06F 1/20 (2006.01); H01L 23/427 (2006.01); H01L 23/40 (2006.01); F28D 15/04 (2006.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
G06F 1/206 (2013.01); H01L 23/427 (2013.01); F28D 15/0275 (2013.01); F28D 15/04 (2013.01); F28D 15/046 (2013.01); G06F 1/20 (2013.01); G06F 1/203 (2013.01); G06F 2200/201 (2013.01); H01L 23/40 (2013.01);
Abstract

A heat dissipating device includes a first copper plate, a second copper plate, a plurality of first heat pipes, a plurality of second heat pipes, and a heat dissipating component. Evaporating sections of the first heat pipes and the second heat pipes are clamped between and thermally connected to the first copper plate and the second copper plate. The second heat pipe, the evaporating section of the first heat pipes, the first copper plate, and the second copper plate are positioned at a bottom surface of the heat dissipating component. The second copper plate is thermally connected to the bottom surface of the heat dissipating component. Condensing sections of the first heat pipes is thermally connected to a top surface of heat dissipating component.


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