The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10108091 B1

Date of Patent:

Oct. 23, 2018

Filed:

Jun. 17, 2016

Photosensitive transfer material, pattern formation method, and etching method

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventor:

Morimasa Sato, Fujinomiya, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Stephanie P Duclair

Int. Cl.

CPC ...

H01L 21/311 (2006.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01); G03F 7/039 (2006.01); G03F 7/09 (2006.01); G03F 7/16 (2006.01); C08F 12/22 (2006.01); G03F 7/023 (2006.01); G03F 7/11 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01);

U.S. Cl.

CPC ...

G03F 7/039 (2013.01); C08F 12/22 (2013.01); G03F 7/0233 (2013.01); G03F 7/0392 (2013.01); G03F 7/094 (2013.01); G03F 7/11 (2013.01); G03F 7/161 (2013.01); G03F 7/20 (2013.01); G03F 7/32 (2013.01); G03F 7/40 (2013.01); Y02P 20/582 (2015.11);

Abstract

A photosensitive transfer material including a support and a photosensitive resin composition layer, in which the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B), and the photosensitive resin composition layer does not have an ethylenic crosslinking structure is a positive-type material, is excellent in terms of heat-resistant rectangular properties, etchant resistance, and resist peeling properties, and generates only a small amount of dust during processes; a pattern formation method, and an etching method.

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