The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Oct. 26, 2017
Applicant:

Lite-on Singapore Pte. Ltd., Midview, SG;

Inventors:

Teck-Chai Goh, Singapore, SG;

Sin-Heng Lim, Singapore, SG;

Guang-Li Song, Singapore, SG;

Arakcre Dinesh Gopalaswamy, Bangalore, IN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/00 (2006.01); G01S 17/02 (2006.01); H05K 1/18 (2006.01); H01L 25/16 (2006.01); H01L 31/16 (2006.01); G01S 7/481 (2006.01); H01L 31/0232 (2014.01); G06F 1/32 (2006.01);
U.S. Cl.
CPC ...
G01S 17/026 (2013.01); G01S 7/4813 (2013.01); H01L 25/165 (2013.01); H01L 25/167 (2013.01); H01L 31/02327 (2013.01); H01L 31/16 (2013.01); H05K 1/181 (2013.01); G06F 1/3231 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A proximity sensor and a mobile device using the same are provided. The proximity sensor includes a circuit board, an emitter package, a receiver package, a plastic casing and a lens. The emitter package is disposed on the circuit board and includes an emitter and an emitter housing. The receiver package is disposed on the circuit board and includes a receiver and a receiver housing. The plastic casing covers the emitter package and the receiver package. The plastic casing includes a first opening corresponding to the emitter package and a second opening corresponding to the receiver package. The first opening has a first geometric centerline and the second opening has a second geometric centerline. The height of the emitter package is smaller than that of the receiver package, and the emitter is disposed between the first geometric centerline and the second geometric centerline.


Find Patent Forward Citations

Loading…