The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Nov. 30, 2009
Klaus Elian, Alteglofsheim, DE;
Martin Petz, Hohenkammer, DE;
Uwe Schindler, Reichenbach, DE;
Horst Theuss, Wenzenbach, DE;
Adolf Koller, Regensburg, DE;
Klaus Elian, Alteglofsheim, DE;
Martin Petz, Hohenkammer, DE;
Uwe Schindler, Reichenbach, DE;
Horst Theuss, Wenzenbach, DE;
Adolf Koller, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.