The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Jan. 30, 2015
Applicant:

Honeywell International Inc., Morristown, NJ (US);

Inventors:

James Cook, Freeport, IL (US);

Craig S. Becke, South Vienna, OH (US);

Jamie Speldrich, Freeport, IL (US);

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01F 3/12 (2006.01); G01F 15/00 (2006.01); G01F 15/06 (2006.01); G01F 1/684 (2006.01); G01F 1/692 (2006.01);
U.S. Cl.
CPC ...
G01F 15/006 (2013.01); G01F 1/684 (2013.01); G01F 1/692 (2013.01);
Abstract

A sensor may include a substrate defining a flow channel that extends through the substrate, and a plurality of bond pads on the substrate. A first housing may be disposed along the substrate and may permit at least some fluid to flow from a fluid inlet to a fluid outlet along at least part of the flow channel. A second housing may be disposed along the substrate. A sense die may be disposed between the second housing and the substrate and may include a sensing side facing the substrate with a sense element in registration with the flow channel and a plurality of bond pads on the sensing side that are in registration with, and bump bonded to, the plurality of bond pads on the substrate. An adhesive or other material may be disposed between the sensing side of the sense die and the substrate.


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