The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Feb. 24, 2017
Applicant:

Mcube Inc., San Jose, CA (US);

Inventors:

Sanjay Bhandari, San Jose, CA (US);

Ali J. Rastegar, San Jose, CA (US);

Sudheer S. Sridharamurthy, San Jose, CA (US);

Assignee:

mCube Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 3/00 (2006.01); G01C 19/5712 (2012.01); B81B 7/02 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
G01C 19/5712 (2013.01); B81B 7/008 (2013.01); B81B 7/02 (2013.01); B81B 2201/0242 (2013.01);
Abstract

A CMOS IC substrate can include sense amplifiers, demodulation circuits and AGC loop circuit coupled to the MEMS gyroscope. The AGC loop acts in a way such that generated desired signal amplitude out of the drive signal maintains MEMS resonator velocity at a desired frequency and amplitude. The system can include charge pumps to create higher voltages as required in the system. The system can incorporate ADC to provide digital outputs that can be read via serial interface such as I2C. The system can also include temperature sensor which can be used to sense and output temperature of the chip and system and can be used to internally or externally compensate the gyroscope sensor measurements for temperature related changes. The CMOS IC substrate can be part of a system which can include a MEMS gyroscope having a MEMS sensor overlying the CMOS IC substrate.


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