The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Mar. 31, 2015
Applicant:
3m Innovative Properties Company, St. Paul, MN (US);
Inventors:
Evan L. Schwartz, Vadnais Heights, MN (US);
Claire Hartmann-Thompson, St. Paul, MN (US);
Shijing Cheng, Woodbury, MN (US);
Nicholas C. Erickson, St. Paul, MN (US);
Assignee:
3M Innovative Properties Company, St. Paul, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/17 (2006.01); C08J 3/24 (2006.01); C08G 59/14 (2006.01); B32B 3/28 (2006.01); B32B 27/38 (2006.01); H01L 51/56 (2006.01); B32B 7/06 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/26 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 3/30 (2006.01);
U.S. Cl.
CPC ...
C08G 59/1466 (2013.01); B32B 3/28 (2013.01); B32B 3/30 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/26 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); C08G 59/14 (2013.01); C08J 3/243 (2013.01); C08J 3/244 (2013.01); H01L 51/56 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2255/26 (2013.01); B32B 2307/412 (2013.01); B32B 2307/538 (2013.01); B32B 2405/00 (2013.01); B32B 2451/00 (2013.01); B32B 2457/12 (2013.01); B32B 2457/206 (2013.01); B32B 2551/00 (2013.01);
Abstract
A transfer film includes a template layer having a first major surface and an opposing second major surface. The second major surface includes a structured non-planar release surface. A backfill layer is disposed upon and conforms to the non-planar structured surface. The backfill layer includes a first cross-linked polymer and a plurality of multifunctional monomers, which cure via different and independent curing mechanisms.