The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Dec. 15, 2016
Applicant:

Korea Institute of Science and Technology, Seoul, KR;

Inventors:

Munju Goh, Wanju-gun, KR;

Nam Ho You, Wanju-gun, KR;

Hyeonuk Yeo, Wanju-gun, KR;

Bon-Cheol Ku, Wanju-gun, KR;

Sang Jun Youn, Wanju-gun, KR;

Jin Won Yu, Wanju-gun, KR;

Jin Jung, Wanju-gun, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07C 29/10 (2006.01); B01J 23/34 (2006.01); B01J 23/26 (2006.01); B01J 23/36 (2006.01); B01J 23/46 (2006.01); B01J 27/13 (2006.01); B01J 23/22 (2006.01); C01B 31/04 (2006.01); C01F 7/02 (2006.01); C08J 11/16 (2006.01); C01B 32/17 (2017.01); C01B 32/23 (2017.01); C01B 32/196 (2017.01); C01B 32/956 (2017.01);
U.S. Cl.
CPC ...
C01B 31/0492 (2013.01); B01J 23/22 (2013.01); B01J 23/26 (2013.01); B01J 23/34 (2013.01); B01J 23/36 (2013.01); B01J 23/466 (2013.01); B01J 27/13 (2013.01); C01B 32/17 (2017.08); C01B 32/196 (2017.08); C01B 32/23 (2017.08); C01B 32/956 (2017.08); C01F 7/021 (2013.01); C08J 11/16 (2013.01); C08J 2300/24 (2013.01); C08J 2363/00 (2013.01);
Abstract

For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.


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