The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Aug. 25, 2017
Seiko Epson Corporation, Tokyo, JP;
Hitoshi Takaai, Azumino, JP;
Yuma Fukuzawa, Matsumoto, JP;
Takuma Hayashi, Nagano, JP;
Daisuke Matsumoto, Matsumoto, JP;
Kazuyuki Katagiri, Shiojiri, JP;
Takayuki Shimosaka, Omachi, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
Provided is a method for manufacturing a liquid ejecting head which includes a plurality of chips, each of which includes a plurality of segments, each segment including a pressure generating chamber communicating with a nozzle opening through which liquid is discharged, a diaphragm which is a portion of the pressure generating chamber, and a pressure generating unit causing a pressure change in the pressure generating chamber through the diaphragm, the method including measuring natural frequencies of the plurality of segments included in each of the chips, classifying the chips into ranks using the maximum value of the natural frequencies of the chips as a reference, and manufacturing the liquid ejecting head which includes the chips selected based on the ranks.