The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Apr. 27, 2016
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Do Hyung Kim, Seoul, KR;
Dong-Hee Han, Suwon-si, KR;
Do-Wan Kim, Suwon-si, KR;
Byeong-Cheol Kim, Suwon-si, KR;
Hak Rae Kim, Suwon-si, KR;
Jung Hun Sung, Suwon-si, KR;
Sung-Gwan Woo, Hwaseong-si, KR;
Kyung Woon Jang, Seoul, KR;
Chang Kyu Chung, Suwon-si, KR;
Kyoung Hern Hong, Suwon-si, KR;
Sung-Ju Hwang, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Disclosed herein are a lamination apparatus which adheres substrates to a cover window having a curved surface and a lamination method using the same. The lamination apparatus includes a first jig on which a cover window is mounted, wherein a curved surface portion is formed in the cover window and a curvature center thereof is positioned behind the curved surface portion, a second jig on which a guide member is seated, wherein a substrate is mounted on the guide member and the guide member has a width greater than that of the substrate, and an interference member provided to interfere with both facing front surfaces of the guide member, wherein the interference member interferes with the guide member and the guide member is bent when the second jig approaches the first jig.