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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10105795 B1

PDFFull Text
Date of Patent:
Oct. 23, 2018

Filed:

Jun. 29, 2012

Braze compositions, and related devices

Applicants:

Raghavendra Rao Adharapurapu, Schenectady, NY (US);

Sundeep Kumar, Bangalore, IN;

Mohamed Rahmane, Ballston Lake, NY (US);

Inventors:

Raghavendra Rao Adharapurapu, Schenectady, NY (US);

Sundeep Kumar, Bangalore, IN;

Mohamed Rahmane, Ballston Lake, NY (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorneys:

GE Global Patent Operation

John Darling

Primary Examiner:

Karie O'Neill Apicella

Int. Cl.
CPC ...
H01M 4/64 (2006.01); H01M 4/66 (2006.01); H01M 2/08 (2006.01); H01M 10/04 (2006.01); B23K 35/30 (2006.01); B23K 35/32 (2006.01); H01M 10/39 (2006.01); B23K 35/00 (2006.01); B23K 35/02 (2006.01); C04B 37/00 (2006.01); C04B 37/02 (2006.01); C22C 9/06 (2006.01); C22C 19/05 (2006.01); H01M 10/02 (2006.01); H01M 10/38 (2006.01); B23K 103/18 (2006.01); H01M 2/02 (2006.01); B23K 103/00 (2006.01); B23K 101/18 (2006.01); B23K 101/36 (2006.01); B23K 101/38 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B23K 35/304 (2013.01); B23K 35/001 (2013.01); B23K 35/004 (2013.01); B23K 35/0233 (2013.01); B23K 35/0238 (2013.01); B23K 35/3033 (2013.01); B23K 35/327 (2013.01); C04B 37/006 (2013.01); C04B 37/026 (2013.01); C22C 9/06 (2013.01); C22C 19/05 (2013.01); H01M 2/08 (2013.01); H01M 10/02 (2013.01); H01M 10/39 (2013.01); H01M 10/3963 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 2201/18 (2013.01); B23K 2201/36 (2013.01); B23K 2201/38 (2013.01); B23K 2203/16 (2013.01); B23K 2203/18 (2013.01); B23K 2203/26 (2015.10); B23K 2203/52 (2015.10); C04B 2237/123 (2013.01); C04B 2237/124 (2013.01); C04B 2237/127 (2013.01); C04B 2237/343 (2013.01); C04B 2237/405 (2013.01); C04B 2237/70 (2013.01); H01M 2/0252 (2013.01); H01M 10/38 (2013.01); Y10T 403/479 (2015.01);
Abstract

A braze alloy composition for sealing a ceramic component to a metal component in an electrochemical cell is presented. The braze alloy composition includes copper, nickel, and an active metal element. The braze alloy includes nickel in an amount less than about 30 weight percent, and the active metal element in an amount less than about 10 weight percent. An electrochemical cell using the braze alloy for sealing a ceramic component to a metal component in the cell is also provided.

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