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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10105777 B1

PDFFull Text
Date of Patent:
Oct. 23, 2018

Filed:

Jul. 23, 2015

Joining method and joining system

Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Kosuke Nishikawa, Tokyo, JP;

Hiroyuki Kobayashi, Tokyo, JP;

Hiroyasu Manako, Tokyo, JP;

Assignee:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Erin B Saad

Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/19 (2006.01); B23K 3/04 (2006.01); B23K 35/30 (2006.01); B23K 35/32 (2006.01); C25D 7/04 (2006.01); C25D 5/12 (2006.01); C25D 5/50 (2006.01); C25D 3/50 (2006.01); C25D 3/48 (2006.01); C25D 3/46 (2006.01); C25D 3/38 (2006.01); C25D 3/12 (2006.01); C25D 17/02 (2006.01); C23C 18/48 (2006.01); C23C 18/42 (2006.01); C23C 18/16 (2006.01); C25D 5/10 (2006.01); C23C 28/02 (2006.01); B23K 103/18 (2006.01); B23K 103/12 (2006.01); B23K 103/08 (2006.01); B23K 101/34 (2006.01); B23K 103/22 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0006 (2013.01); B23K 1/0008 (2013.01); B23K 1/19 (2013.01); B23K 3/04 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/3013 (2013.01); B23K 35/3033 (2013.01); B23K 35/322 (2013.01); C23C 18/1632 (2013.01); C23C 18/42 (2013.01); C23C 18/48 (2013.01); C23C 28/023 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 3/46 (2013.01); C25D 3/48 (2013.01); C25D 3/50 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/50 (2013.01); C25D 7/04 (2013.01); C25D 17/02 (2013.01); B23K 2201/34 (2013.01); B23K 2203/08 (2013.01); B23K 2203/12 (2013.01); B23K 2203/18 (2013.01); B23K 2203/22 (2013.01);
Abstract

A joining method for joining a first member and a second member is provided. The joining method includes a step of providing a first brazing layer on the first member by plating, a step of providing a second brazing layer on the first brazing layer by plating, a step of arranging the first member and the second member to oppose each other across the first brazing layer and the second brazing layer, and a step of melting the first brazing layer and the second brazing layer to join the first member and the second member which are arranged to oppose each other.

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Nishikawa, Kosuke. (2018). Joining method and joining system (U.S. Patent No. 10105777). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10105777

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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