The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Sep. 01, 2011
Applicants:

Reinhold Bayerer, Warstein, DE;

Georg Borghoff, Warstein, DE;

Inventors:

Reinhold Bayerer, Warstein, DE;

Georg Borghoff, Warstein, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 33/00 (2010.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/562 (2013.01); H01L 24/32 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/12042 (2013.01); Y10T 29/4935 (2015.01);
Abstract

A semiconductor module includes a base plate having an inner region adjacent an edge region, a substrate attached to the inner region of the base plate and a heat sink on which the base plate is mounted so that the base plate is interposed between the substrate and the heat sink and at least part of the inner region of the base plate contacts the heat sink. The module further includes a stress relief mechanism configured to permit the base plate to bend away from the heat sink in the edge region responsive to a thermal load so that at least part of the inner region of the base plate remains in contact with the heat sink.


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