The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
May. 11, 2016
Applicant:
Toshiaki Nakajima, Tokyo, JP;
Inventor:
Toshiaki Nakajima, Tokyo, JP;
Assignee:
RICOH COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0014 (2013.01); H05K 1/189 (2013.01); H05K 3/285 (2013.01); H05K 3/284 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/0139 (2013.01); H05K 2203/0759 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract
A flexible printed circuit board includes a thin film electrical insulation substrate made of heat-curable resin having heat resistance and electrical insulation properties, an electrically conductive pattern composed of an electric conductor formed on the thin film electrical insulation substrate in a prescribed shape, and a thin film cover lay made of heat-curable resin placed and cured on the thin film electrical insulation substrate to cover the electrically conductive pattern.