The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Oct. 07, 2015
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Mihee Lee, Gyunggu-Do, KR;

Jung-Ju Suh, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 9/00 (2006.01); G06F 1/20 (2006.01); H01L 23/473 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); G06F 1/203 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 9/0032 (2013.01); H04M 1/0277 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10522 (2013.01);
Abstract

Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.


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