The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Dec. 18, 2014
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Kenji Hayashi, Hino, JP;
Akihiro Fukuzawa, Fujimi-machi, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/22 (2013.01); H03H 9/08 (2006.01); H05B 1/02 (2006.01); H05B 3/14 (2006.01); H03L 1/04 (2006.01); H03H 9/05 (2006.01); H03L 1/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/08 (2013.01); H03H 9/0547 (2013.01); H03L 1/028 (2013.01); H03L 1/04 (2013.01); H05B 1/023 (2013.01); H05B 3/143 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/16195 (2013.01);
Abstract
An IC for heating includes a semiconductor, substrate on which a diffusion layer is formed; a first pad that applies a power source voltage to the diffusion layer; and a second pad that applies a ground voltage to the diffusion layer. A semiconductor substrate includes slits such that the slits intersect a virtual straight line connecting the pads when the semiconductor substrate is seen in a plan view.
Hayashi, Kenji. (2018). Heating body, vibration device, electronic apparatus, and moving object (U.S. Patent No. 10103708). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10103708
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile