The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

May. 22, 2015
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Sundeep Kumar, Bangalore, IN;

Mohamed Rahmane, Niskayuna, NY (US);

Hongbo Cao, Niskayuna, NY (US);

Darren Michael Stohr, Niskayuna, NY (US);

Raghavendra Rao Adharapurapu, Bangalore, IN;

Ravikumar Hanumantha, Bangalore, IN;

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/08 (2006.01); H01M 10/02 (2006.01); H01M 10/39 (2006.01); B23K 35/30 (2006.01); C04B 37/02 (2006.01);
U.S. Cl.
CPC ...
H01M 10/3963 (2013.01); B23K 35/3033 (2013.01); B23K 35/3046 (2013.01); C04B 37/026 (2013.01); H01M 2/08 (2013.01); C04B 2235/656 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6582 (2013.01); C04B 2237/122 (2013.01); C04B 2237/123 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/128 (2013.01); C04B 2237/343 (2013.01); C04B 2237/405 (2013.01); C04B 2237/55 (2013.01); C04B 2237/597 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); C04B 2237/765 (2013.01); C04B 2237/80 (2013.01); Y10T 156/10 (2015.01); Y10T 428/12611 (2015.01);
Abstract

A method for joining a metal component to a ceramic component is presented. The method includes disposing a metallic barrier layer on a metallized portion of the ceramic component, and joining the metal component to the metallized portion of the ceramic component through the metallic barrier layer. The metallic barrier layer comprises nickel and a melting point depressant. The metallic barrier layer is disposed by a screen printing process, followed by sintering the layer at a temperature less than about 1000 degrees Celsius. A sealing structure including a joint between a ceramic component and a metal component is also presented.


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