The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

May. 13, 2013
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Keiichi Kaneko, Mishima, JP;

Tsugio Fujisawa, Susono, JP;

Noriyuki Kitao, Shizuoka-ken, JP;

Makoto Adachi, Numazu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 4/92 (2006.01); H01M 4/88 (2006.01); H01M 4/86 (2006.01); H01M 4/90 (2006.01); H01M 8/1018 (2016.01);
U.S. Cl.
CPC ...
H01M 4/925 (2013.01); H01M 4/8657 (2013.01); H01M 4/88 (2013.01); H01M 4/9041 (2013.01); H01M 4/9075 (2013.01); H01M 4/921 (2013.01); H01M 4/881 (2013.01); H01M 4/8807 (2013.01); H01M 4/8828 (2013.01); H01M 2008/1095 (2013.01);
Abstract

Disclosed is a method for producing a fine catalyst particle comprising a palladium-containing particle and a platinum outermost layer covering the palladium-containing particle, wherein a first composite body containing palladium and platinum is formed by mixing the palladium-containing particle with a first solution in which a platinum compound is dissolved, and then covering at least part of a surface of the palladium-containing particle with platinum; wherein a second composite body containing palladium, platinum and copper is formed by mixing the first composite body with a second solution in which a copper compound is dissolved, and then covering at least part of a surface of the first composite body with copper using copper underpotential deposition; and wherein the copper in the second composite body is substituted with platinum derived from a third solution in which a platinum compound is dissolved.


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