The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Nov. 27, 2015
Applicant:
Konica Minolta, Inc., Tokyo, JP;
Inventors:
Shigeru Kojima, Hino, JP;
Kazuhiro Yoshida, Tachikawa, JP;
Shun Furukawa, Sagamihara, JP;
Takeshi Hakii, Sagamihara, JP;
Assignee:
KONICA MINOLTA, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H05B 33/28 (2006.01); B32B 7/02 (2006.01); H01B 5/14 (2006.01); B32B 15/04 (2006.01); C23C 18/31 (2006.01); H01L 51/00 (2006.01); H05K 1/02 (2006.01); C25D 3/12 (2006.01); C25D 3/38 (2006.01); C25D 3/46 (2006.01); C25D 5/12 (2006.01); C23C 18/38 (2006.01); H05K 1/09 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5215 (2013.01); B32B 7/02 (2013.01); B32B 15/04 (2013.01); C23C 18/31 (2013.01); H01B 5/14 (2013.01); H01L 51/0022 (2013.01); H05B 33/28 (2013.01); H05K 1/0274 (2013.01); B32B 2307/202 (2013.01); B32B 2307/412 (2013.01); B32B 2457/206 (2013.01); C23C 18/38 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 3/46 (2013.01); C25D 5/12 (2013.01); H01L 2251/303 (2013.01); H01L 2251/305 (2013.01); H05K 1/097 (2013.01); H05K 3/246 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0329 (2013.01); H05K 2201/09681 (2013.01); H05K 2203/121 (2013.01);
Abstract
A transparent electrode includes: a substrate; and a conductive metal layer on the substrate. The conductive metal layer has a thin metal wire and a plating layer. The plating layer covers the thin metal wire. The transparent electrode further includes a transparent conductive layer on a surface of the substrate on a side on which the thin metal wire is formed. The transparent conductive layer covers the substrate and the conductive metal layer. The thin metal wire is formed using a metal nanoparticle ink or a metal complex ink.