The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Jun. 30, 2017
Applicant:

Nichia Corporation, Anan-shi, JP;

Inventors:

Hiroaki Ukawa, Anan, JP;

Yusuke Hayashi, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 33/48 (2010.01); H01L 33/44 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/60 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light emitting device includes a base member, a light emitting element, a wire, a protective film, first and second resin members, and a light shielding portion. The base member has a conductive member. The wire connects the light emitting element and the conductive member. The protective film covers the conductive member to be spaced apart from a portion of a connecting portion. The first resin member has a first gas barrier property with respect to hydrogen sulfide and a first light resistance. The second resin member has a second gas barrier property with respect to hydrogen sulfide lower than the first gas barrier property and a second light resistance higher than the first light resistance. The light shielding portion is disposed on a surface of the base member and disposed on a line connecting the light emitting element and the first resin member.


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