The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Feb. 16, 2016
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Myung Hee Kim, Seoul, KR;

Jung Yeop Hong, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/52 (2010.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 33/005 (2013.01); H01L 33/502 (2013.01);
Abstract

An embodiment relates to a light emitting device package and a manufacturing method of the light emitting device package. The light emitting device package according to an embodiment may include a body having a top opened cavity, a light emitting device mounted on an inner bottom surface of the cavity, and a molding part accommodated in the cavity to protect the light emitting device, and the molding part may include a CYTOP, and thus not only light efficiency can be enhanced but also the reliability of the product can be improved with high durability.


Find Patent Forward Citations

Kim, Myung. (2018). Manufacturing method of light emitting device package (U.S. Patent No. 10103295). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10103295

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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